Facilities
Cleanroom
Class 100 and 1000 Cleanrooms are shared facilities within CRANN.
Class 100 Cleanroom
This room is used primarily for UV Lithography. Its facilities include:- Spin resist
- UV Mask Aligner
- Laser Mask Writer (Heidelberg DWL66)
- Solvent wet bench
- Dry Plasma Etcher (OIPT Plasmalab System100 ICP180)
- Acid wet bench
Class 1,000 Cleanroom
This room contains a variety of deposition systems- Temescal Evaporation System
This is a flexible tool, commonly used in conjunction with UV and E-beam Lithography. Its features include:
- 6-pocket electron beam evaporation source, a thermal evaporation source
- ion source
- substrate infrared heater and liquid nitrogen cooler
- process gas controller
- fast-cycle load lock
- LPCVD Evaporation System
- Automated wafer dicing system (Disco DAD 3220 wafer dicer)
For more information on these and more devices, see the cleanroom page on the CRANN website.