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Nicolas Alexandre Baudin
Research Fellow, Mechanical & Manuf. Eng


Dr. Nicolas Baudin is a postdoctoral research fellow under the supervision of Dr. Tim Persoons and Dr. Tony Robinson. He is currently working on a project to develop reliable light-weight vapour chamber heat sinks for wireless communication applications, using novel materials and heat transfer enhancement techniques, in collaboration with Dr. Roger Kempers and Dr. Brian Donnelly from Alcatel-Lucent and Bell Labs Ireland. Nicolas obtained his PhD in Toulouse (France) at the Institut de Mécanique des Fluides de Toulouse on an experimental study of transient heat transfer in convective, nucleate boiling and film boiling regimes in a semi-annular duct.

Publications and Further Research Outputs

Peer-Reviewed Publications

M.J. Deasy, N. Baudin, S. M. O'Shaughnessy, A.J. Robinson, Simulation-Driven Design of a Passive Liquid Cooling System for a Thermoelectric Generator, Applied Energy, 205, 2017, p499 - 510 Journal Article, 2017 URL DOI TARA - Full Text

Baudin, N and Colin, C and Ruyer, P and Sebilleau, J, Turbulent flow and transient convection in a semi-annular duct, International Journal of Thermal Sciences, 108, 2016, p40 - 51 Journal Article, 2016 DOI

Baudin, N and Colin, C and Ruyer, P and Sebilleau, J, Heat Transfer Characterization During Transient Boiling, International Heat Transfer Conference 15, Kyoto, 2014, edited by Begell Hourse, IHTC Digital Library , 2014 Conference Paper, 2014 DOI

Research Expertise


Research interests: Fluid dynamics, heat transfer, boiling, transient phenomena, natural/forced convection
Experimental skills: Infrared thermography, Shadow imaging, Particle image velocimetry
Computational skills: ANSYS (fluent, CFX), StarCCM+


  • Title
    • Light-weight vapour chamber heat sinks for wireless communication applications
  • Summary
    • Electronic equipment such as wireless data transmission units are generating more and more localised heat power which should be dissipated effectively to ensure the reliability of the device. In a conventional solid heat sink, a metal base plate is in contact with the heat sources, and plate fins dissipate the heat to the environment by conduction and natural convection. One of the goals of this project is to reduce the weight of the cooling solution without sacrificing performance.
      In a vapour chamber heat sink, the base plate is hollow, filled with a fluid at saturation conditions, which boils at the bottom in contact with the heater and condenses at the top in contact with the fins. The thermal resistance can be lowered due to the efficacy of the boiling and condensation heat transfer, which in turn allows to reduce the overall weight of the structure.
      The aim of the project is to understand and design an optimised light-weight vapour chamber heat sink by means of (i) optimisation of the natural convection by changing the fin structure and other active enhancement methods, (ii) understanding and improving the boiling/condensation inside the vapour chamber, (iii) and the use of unconventional materials and manufacturing methods.
  • Funding Agency
    • Enterprise Ireland (Innovation Partnership Scheme, co-funded by the European Union through the Europ
  • Date From
    • december 2015
  • Date To
    • mai 2017