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Facilities

Cleanroom

Facilities

Class 100 and 1000 Cleanrooms are shared facilities within CRANN.

Class 100 Cleanroom

This room is used primarily for UV Lithography. Its facilities include:
  • Spin resist
  • UV Mask Aligner
  • Laser Mask Writer (Heidelberg DWL66)
  • Solvent wet bench
  • Dry Plasma Etcher (OIPT Plasmalab System100 ICP180)
  • Acid wet bench


Class 1,000 Cleanroom

This room contains a variety of deposition systems
  • Temescal Evaporation System
    This is a flexible tool, commonly used in conjunction with UV and E-beam Lithography. Its features include:
    • 6-pocket electron beam evaporation source, a thermal evaporation source
    • ion source
    • substrate infrared heater and liquid nitrogen cooler
    • process gas controller
    • fast-cycle load lock
  • LPCVD Evaporation System
  • Automated wafer dicing system (Disco DAD 3220 wafer dicer)

For more information on these and more devices, see the cleanroom page on the CRANN website.

Contacts for our work in the Cleanroom

  • Leo Farrell
    CRANN, 2.24
    E-mail: lefarrel@tcd.ie
    Phone: +353 (0) 896 3808

  • Askar Syrlybekov
    CRANN
    E-mail: syrlybea@tcd.ie