Magnetron Sputtering
The specifications of our multi-target UHV sputtering system are:
- UHV growth chamber with a base pressure of <5 x 108Torr
- Three 2" and one 1.5" magnetron guns
- DC and RF power supplies
- Maulti-gas line (Ar, O2, etc) with MFC controller
- Load-lock chamber
- Oxygen compatible sample heater (RT - 900 K)
- External magnetic field during sputtering/li>
Applications include:
- Metal oxide films
- Magnetic tunnel junctions
- Multilayer structure thin films